 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uz6aO-0000RNC; Fri, 6 Sep 96 14:29 CDT |
| Old-Return-Path: |
|
| Date: |
Fri, 6 Sep 1996 15:37:01 -0400 |
| Precedence: |
list |
| Resent-From: |
|
| Message-ID: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"eXWUq1.0.7D8._j7Co"@ipc> |
| Subject: |
|
| From: |
|
| From [log in to unmask] Fri Sep 13 08: |
46:02 1996 |
| X-Loop: |
|
| Resent-Sender: |
|
| Parts/Attachments: |
|
|
I'm looking for some input from board fabricators.
1. Does anyone cross section after electroless as a routine? If so, how
often?
2. How frequently do you cross section after pattern plate? Do you use
coupons or actual parts? If you use both, what is the ratio, coupons/actual
parts? What is the frequency? How much do you rely on nondestructive testing?
Thanks in advance for your input.
David Pizzoferrato
QA Manager
Centerline Circuits
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
