TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0uyOHh-0000OoC; Wed, 4 Sep 96 15:10 CDT
Old-Return-Path:
Date:
04 Sep 96 16:16:00 EDT
From [log in to unmask] Wed Sep 4 17:
07:27 1996
Precedence:
list
X-Loop:
Resent-Sender:
TechNet-request [log in to unmask]
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/6066
TO:
Return-Path:
<TechNet-request>
Resent-Message-ID:
<"QE6S01.0.YaB.89UBo"@ipc>
Subject:
From:
Message-ID:
Resent-From:
Parts/Attachments:
text/plain (21 lines)
Questions from a telecomms designer:

What is the max continuous operating temperature for a COMPONENT on a vertically
orientated PCB (without  thermal management) without causing "damage" to the
substrate?

Has anyone derived a time/temp situation in reflow that would result in
significant degregation of the PCB such that personnel might be affected by
toxic fumes?

Thanks,   George Wheadon  

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2