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| From [log in to unmask] Wed Aug 28 09: |
07:25 1996 |
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My passed experience using wet lam was a nightmare. Beware of hold times!!!
Film lockin became a major issue. After 24 hours film would not develop off completely causing a major problem at etch. At the time this was experienced with 9015 and GA1.5.
The coating process needed constant attention. DI water was used and trying to keep an even flow of water the panels was difficult.
Hope this helps you look at potential problems.
Good Luck
[log in to unmask]
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From: [log in to unmask] (didier abiven)
Sent: Monday, August 26, 1996 11:02 PM
To: [log in to unmask]
Subject: experience of wet lamination with Dstf or Mls copper laminate
I would like to know if somebody has the experience of wet lamination in a
process using MLS or Dstf copper on base laminate for innerlayer core.
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