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| From [log in to unmask] Tue Aug 27 16: |
33:42 1996 |
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Have just come on technet and saw partial on this. I did some work on this and
can pass material and processing details if the subject is still open. It can be
relatively simple.
Mike Fenner
BSP
---------------------------------------------
On 23 August 1996 Duglas Stewart wrote
SUBJECT: re-filling vias with RESIN
REFERENCE: question previously
I believe someone was looking for a way to completely fill vias with RESIN (not
the sequential blind via type)
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