TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0uvTQn-0000NeC; Tue, 27 Aug 96 14:04 CDT
Old-Return-Path:
Date:
Tue, 27 Aug 1996 15:12:10 -0400
From [log in to unmask] Tue Aug 27 14:
21:55 1996
Precedence:
list
X-Loop:
Message-ID:
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/5982
TO:
Return-Path:
<TechNet-request>
Resent-Message-ID:
<"qmGrC.0.AHH.eQq8o"@ipc>
Subject:
From:
Resent-From:
Resent-Sender:
TechNet-request [log in to unmask]
Parts/Attachments:
text/plain (21 lines)
Using foil on the outside layers of multilayers is permitted.
Depending upon which spec you use this requires that
a peel strength test be performed monthly on randomly
selected lots as part of Group B testing.

I don't think DESC has ever allowed a board to be built
completely of prepreg and foil, but then I'm not certain.
To my knowledge this would not be permitted.

Susan Mansilla
Robisan Lab

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2