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Tue, 27 Aug 1996 12:39:25 -0400 |
| From [log in to unmask] Tue Aug 27 14: |
20:45 1996 |
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When producing multi layer PCBs to MIL-P-55110 we have historically used a
"cap" build.,as the
interpretation was that to use a "foil" build we would have to get approval
under MIL-P-13949,a laminate
spec.. Is this the general concensus or are people using foil builds against
the 55110 spec??
Regards
Paul Greene
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