 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uv3er-0000LBC; Mon, 26 Aug 96 10:32 CDT |
| Content-Type: |
TEXT/PLAIN; charset=US-ASCII |
| Old-Return-Path: |
<holmjo> |
| Date: |
Mon, 26 Aug 1996 10:32:46 -0500 (CDT) |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| MIME-Version: |
1.0 |
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<ChipNet-request> |
| X-Status: |
|
| X-Loop: |
|
| From [log in to unmask] Mon Aug 26 10: |
50:21 1996 |
| Subject: |
|
| From: |
|
| Resent-Message-ID: |
<"Ciq9s3.0.wbJ.eES8o"@ipc> |
| In-Reply-To: |
|
| Message-ID: |
<Pine.3.89.9608261022.C29084-0100000@ipc> |
| cc: |
|
| Parts/Attachments: |
|
|
The BGA section of the IPC-A-610 is at the early draft stages. The
current plans are to issue all the new technology criteria together, so
it will be at least a year before you'll see something. We do have the
J-STD-013, "Implementation of Ball Grid Array and other High Density
Technology" which is the criteria that the 610 workmanship would follow.
****************************************************
Jon Holmen
Technical Project Manager
IPC
2215 Sanders Road
Northbrook IL 60062-6135
Phone (847) 509-9700 ex329
Fax (847) 509-9798
e-mail [log in to unmask]
URL:http://www.ipc.org
*****************************************************
On Thu, 22 Aug 1996 [log in to unmask] wrote:
> If I look at the back of IPC-A-610B Section 11, for BGAs is WIP.
>
> I'm just wondering if there is a guess as to when that will be coming out.
>
> In the meantime does anyone know of any "Industry" Workmanships
> Standards that are out there that I can use to evaluate BGA's.
>
> Thanks.
>
> A
>
> Andy Heidelberg
> Micron Custom Manufacturing Services
> 8455 Westpark Street
> Boise, Idaho 83704
> 208-368-2784
>
> [log in to unmask]
>
>
> ***************************************************************************
> * TechNet mail list is provided as a service by IPC using SmartList v3.05 *
> ***************************************************************************
> * To unsubscribe from this list at any time, send a message to: *
> * [log in to unmask] with <subject: unsubscribe> and no text. *
> ***************************************************************************
>
>
****************************************************************************
* ChipNet mail list is provided as a service by IPC using SmartList v3.05 *
****************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
****************************************************************************
|
|
|
