 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uv2Vv-0000NeC; Mon, 26 Aug 96 09:19 CDT |
| Old-Return-Path: |
|
| Date: |
Mon, 26 Aug 96 07:28:13 PST |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| From [log in to unmask] Mon Aug 26 10: |
48:09 1996 |
| Subject: |
|
| From: |
|
| Resent-Message-ID: |
<"89YER2.0.sFG.w9R8o"@ipc> |
| X-Loop: |
|
| Message-Id: |
|
| Parts/Attachments: |
|
|
Dougal,
I am interested in both. Can you give me more information regarding the
copper filling process.
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: re-filling vias with RESIN
Author: [log in to unmask] at corp
Date: 8/23/96 11:19 AM
> DATE: 23 August 1996
> SUBJECT: re-filling vias with RESIN
> REFERENCE: question previously
>
> I believe someone was looking for a way to completely fill vias
> with RESIN (not the sequential blind via type).
>
> For whoever was interested, there is a company in France called
> LAPE who are subcontractors for pcb fabrication processes including
> soldermask, HASL etc processes. One of the processes that they
> offer is via hole injection filling, where they use a CNC
> controlled, syringe injection system for filling holes with resin.
>
> More details from LAPE on +33 (1) 60 86 51 83 or
> fax +33 (1) 60 86 51 80
>
>
> Dougal Stewart
> Product development manager
> Exacta Circuits
> Scotland
Component Intertechnologies can fill vias with copper using a forming
process. If this is of any interest please contact me.
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
