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| From [log in to unmask] Fri Aug 23 10: |
23:55 1996 |
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I am having a little trouble interpreting the inprocess sampling plan
requirements of Mil-P-55110E AM1 (Para. 4.6.1). I'm not sure exactly how
many boards per day we are supposed to be testing inprocess. It states that
you may group lots together based on same materials, same type or types of
interfacial connections and terminations, and same processing requirements.
Can anyone tell me how they interpret this paragraph ? Thanks.
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