Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0tkJMY-00008KC; Wed, 7 Feb 96 17:33 CST |
Content-Type: |
text/plain; charset="us-ascii" |
Old-Return-Path: |
|
Date: |
Wed, 7 Feb 1996 17:39:50 -0600 |
Precedence: |
list |
Resent-From: |
|
Resent-Sender: |
|
X-Status: |
|
Status: |
O |
X-Mailing-List: |
|
X-Sender: |
|
TO: |
|
Return-Path: |
|
Resent-Message-ID: |
<"B6xQj1.0.O8D.0RJ6n"@ipc> |
Subject: |
|
From: |
|
Mime-Version: |
1.0 |
X-Loop: |
|
From [log in to unmask] Wed Feb 7 17: |
40:07 1996 |
Message-Id: |
<ad3ee7d6060210044357@[157.175.110.24]> |
Parts/Attachments: |
|
|
Saw a reference on the Web to this book:
Design Guidelines for Surface Mount & Fine-Pitch Technology
Title: Design Guidelines for Surface Mount & Fine-Pitch Technology
Author: Vern Solberg
Publisher: McGraw-Hill Company
Info: Pubished 1996: 260 pages. ISBN 0-07-059577-1
CHAPTERS
1: Planning for Surface Mount Design
2: Component Selection for SMT
3: Land Pattern Development for SMT
4: Space Planning and Interface
5: Layout Guidelines for Rigid Circuits
6: SMT Layout and Guidelines for FLexible Circuits
7: Design Requirements for Fine-Pitch Devices
8: Providing for Test Automation
9: Specifying Substrate Materials and Fabrication Options
10: SMT Assembly Process
11: Aqueous Cleaning for Surface Mount Assemblies: Elimination
of CFC Materials from the SMT Manufacturing Environment
12: Design Evaluation for Efficient Assembly Processing
Looks interesting, but has anyone seen this, is it reasonably well done?
Not that I doubt it...
regards,
Jerry Cupples
Interphase Corporation
Dallas, TX
http://www.iphase.com
|
|
|