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TO: I4235700 IBMMAIL new address for ipc technet 25.6.96
FROM: DSTEWART EX2 D.Stewart - Product Development Manager.
DATE: 23 August 1996
SUBJECT: re-filling vias with RESIN
REFERENCE: question previously
I believe someone was looking for a way to completely fill vias
with RESIN (not the sequential blind via type).
For whoever was interested, there is a company in France called
LAPE who are subcontractors for pcb fabrication processes including
soldermask, HASL etc processes. One of the processes that they
offer is via hole injection filling, where they use a CNC
controlled, syringe injection system for filling holes with resin.
More details from LAPE on +33 (1) 60 86 51 83 or
fax +33 (1) 60 86 51 80
Dougal Stewart
Product development manager
Exacta Circuits
Scotland
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