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From: Scott Westheimer
Date: 8/23/96
Ref.: PCB Fabrication
I am looking for a paper that was done about 5 or 6 years ago. It covered a
round robin test that was performed using different materials with
different Tg's. The purpose of the test was to evaluate failures in the PTH
during thermal cycling to determine what if any effect the Tg had on hole
quality. Can someone either send this to me or direct me in the right
direction.
Thanks
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