TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0utgjN-0000N5C; Thu, 22 Aug 96 15:51 CDT
Old-Return-Path:
Date:
Thu, 22 Aug 1996 13:55:59 -0800
Precedence:
list
Resent-From:
From [log in to unmask] Fri Aug 23 08:
59:16 1996
Resent-Sender:
TechNet-request [log in to unmask]
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/5906
TO:
Return-Path:
<TechNet-request>
Resent-Message-ID:
<"Yd007.0.TC7.iXC7o"@ipc>
Subject:
From:
Jamal Amouzadeh <[log in to unmask]>
X-Loop:
X-Mailer:
Novell GroupWise 4.1
Message-Id:
Parts/Attachments:
text/plain (16 lines)
I need information about using the part of copper of the a PC board
ground plane as a heatsink for a power regulator. If anybody has any
information please let me know where I can get those informatioms. My
E_mail address is     [log in to unmask]

Thanks

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2