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| From [log in to unmask] Tue Aug 20 13: |
23:19 1996 |
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We experienced voiding on one lot at one particular layer where Arlon
polyimide laminate (0.018) and ADI 2116 polyimide prepreg interfaced.
Voiding affected about half the holes on the boards of all sizes. SEM/EDAX
analysis showed P, Sn, Cl, Pb, C, O, and a Sn/Ca peak. We never found out
what the cause was. Hope this gives you a clue.
Regards,
Peter at PC World
416-299-4000
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Subject: Calcium ion on laminate
Author: [log in to unmask] at INET
Date: 8/14/96 8:26 PM
SEM/EDX analysis of a voided area on an electroless Cu deposit on Mitsubishi
BT laminate shows Si, O, Br and Ca ions. Si and O coming from glass, Br
from epoxy as a flame retardant; where is Ca ion coming from (DI water used
everywhere)? Has anyone else experienced uneven Cu deposit on this type of
laminate(the larger the hole or cavity the higher occurence of voiding)???
C-stage of this laminate is deliberately undercured; can this have any
impact on the voiding problem?
Thanks for help,
Paul
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