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| From [log in to unmask] Tue Aug 20 09: |
16:53 1996 |
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We are beginning to see more PCB suppliers offering matte finish LPI. We
have heard that this finish reduces the adherence of solderballs. Is this
true? If so, at which process, reflow or wave? What is the science behind
this lessening of solderballs?
2nd Question: We are also starting a project that will require conformal
coating. Is there a preference in solder mask type/finish? The coatings we
are leaning towards are silicone-based.
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