 
| Mime-Version: |
1.0 |
| Content-Type: |
text/plain; charset="us-ascii" |
| Old-Return-Path: |
|
| Date: |
Sat, 10 Aug 1996 08:12:38 -0700 (PDT) |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| X-Status: |
|
| From [log in to unmask] Mon Aug 12 14: |
01:05 1996 |
| X-Mailing-List: |
|
| X-Sender: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Status: |
O |
| Resent-Message-ID: |
<"v2ddm.0.ZlK.9KA3o"@ipc> |
| Subject: |
|
| From: |
|
| X-Loop: |
|
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0upFak-0000KeC; Sat, 10 Aug 96 10:04 CDT |
| X-Mailer: |
Windows Eudora Version 1.4.3 |
| Message-Id: |
|
| Parts/Attachments: |
|
|
We were forwarded a message sent by Jim Zanolli who wqas looking for help in
soldering leaded components using solder paste. We offer a book with Excel
spreadsheets that tell all about how to do this "Using Solder Paste for
Leaded Components on SMT Assemblies" written by James C. Blankenhorn and it
sells for $149.95. To get additional information about this product you may
do so by contacting SMT Plus Inc, 5403-F Scotts Valley Drive, Scotts Valley,
CA 95066, call (408) 438-6116, fax (408) 438-5450, or email [log in to unmask]
Regards,
Jim Blankenhorn
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
