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From: Paul Leger
Subject: ASSY: SPEC FOR PULL TEST
Hi there,
Just wondering if a spec (IPC preferably) exist for the minimum amount of
force required to pull and shear SMT components off a PCB in a solder
paste process after the card has been reflowed.
If it's an IPC spec I just need the spec number.
later,
Paul Leger
Process Engineering (SMT)
[log in to unmask] (416) 448-4712
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