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From: Stephen Ayotte
EM Quality Engineering
Bldg. 14-3 Col F5 5-1537
Subject:
IPC-SM-840B or C requires panels to be conditioned using IPC-S-804
prior to measure the solder mask adhesion. 804 has been replaced
by J-STD-003. There are many solderability tests within that
document. Specifically which one should be used for pre-conditioning
for solder mask adhesion testing as required by 840?
Thanks.
**** IBM MD Product Quality Engineer ****
**** OEM Quality Engineer ****
**** Interenterprise Address: USIB6CEF ****
**** Internet Address: [log in to unmask] ****
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