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id m0uoKml-0000KLC; Wed, 7 Aug 96 21:25 CDT |
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53:05 1996 |
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Has anyone been working on resin-in-via before? I would like to know more
detail concerning this. I understand that resin is used to fill up the vias so that solder will not flow through the exposed pads, this allow via-in-pad concept to be workable. What type of resin is this? Where and how is this process done during fabrication?
Any info is appreciated.
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