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From [log in to unmask] Wed Aug 7 12: |
42:21 1996 |
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<"24Bye3.0.DeA.Y3A2o"@ipc> |
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You need to verify the footprint of the component! Are they compatabile to
IPC-SM-782? Reduce the width of the pads will also help. Of course, the
problem can be vendor related.
Thanks
Michael Yuen
----------
From: TechNet-request
To: technet
Subject: ASS: Cracking of Decoupling Caps
Date: Monday, August 07, 1995 9:26AM
I have a mixed technology board - bottom side smt power supply which is
failing. I suspect that the failure is due to the unreliability of
decoupling ceramic caps.
On reworking the caps they tend to crack.
I have subjected them to thermal shock tests and they seem to retain their
integrity.
Any suggestions? Is it a vendor problem (which seems unlikely) only?
Thanks in advance.
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