 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uo6bM-0000KoC; Wed, 7 Aug 96 06:16 CDT |
| Content-Type: |
text/plain; charset=us-ascii |
| CC: |
|
| References: |
|
| Date: |
Wed, 07 Aug 1996 07:25:08 -0400 |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| MIME-Version: |
1.0 |
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| X-Status: |
|
| X-Loop: |
|
| Old-Return-Path: |
|
| Content-Transfer-Encoding: |
7bit |
| Resent-Message-ID: |
<"TMJX2.0.Zz9.Ki72o"@ipc> |
| Subject: |
|
| From: |
|
| From [log in to unmask] Wed Aug 7 08: |
41:59 1996 |
| X-Mailer: |
Mozilla 2.0 (Win95; I) |
| Organization: |
Paragon Networks Inc. |
| Message-ID: |
|
| Parts/Attachments: |
|
|
Maurice Dore * wrote:
>
> I have a mixed technology board - bottom side smt power supply which is
> failing. I suspect that the failure is due to the unreliability of
> decoupling ceramic caps.
> On reworking the caps they tend to crack.
> I have subjected them to thermal shock tests and they seem to retain their
> integrity.
> Any suggestions? Is it a vendor problem (which seems unlikely) only?
> Thanks in advance.
>
Maurice,
Are the leads of the cap bent in any way outward
to mount them on the board? I've had that happen.
What appeared to be a subtle bending turned into a
crack when put through soldering.
Doug
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
