 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uo3lO-0000ExC; Wed, 7 Aug 96 03:14 CDT |
| Encoding: |
10 TEXT |
| Old-Return-Path: |
|
| Date: |
Mon, 07 Aug 95 09:26:00 GMT |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"R0fvS.0.8J6.r152o"@ipc> |
| Subject: |
|
| From: |
|
| From [log in to unmask] Wed Aug 7 08: |
41:46 1996 |
| X-Loop: |
|
| X-Mailer: |
Microsoft Mail V3.0 |
| Message-ID: |
|
| Parts/Attachments: |
|
|
I have a mixed technology board - bottom side smt power supply which is
failing. I suspect that the failure is due to the unreliability of
decoupling ceramic caps.
On reworking the caps they tend to crack.
I have subjected them to thermal shock tests and they seem to retain their
integrity.
Any suggestions? Is it a vendor problem (which seems unlikely) only?
Thanks in advance.
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
