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id m0unxDK-0000LUC; Tue, 6 Aug 96 20:15 CDT |
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| From [log in to unmask] Wed Aug 7 08: |
40:20 1996 |
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Is there an IPC void size specification for PBGA's detected by
transmission X-ray (we use Nicolett Systems).
Our current guideline is- voids are acceptable only if they are
smaller than 20% of the diameter of the solder ball. What is your
criteria for acceptability?
Do you have reliability data to support your specification? Has there
been any published papers specifically on the effects of voids on the
reliability of PBGA solder joints?
Sincerely,
Eric Fremd
Process Developement Engineer
Solectron Technical Center
(408) 956-6194
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