Mime-Version: |
1.0 |
Content-Type: |
text/plain; charset="us-ascii" |
Old-Return-Path: |
|
Date: |
Tue, 6 Aug 1996 13:40:46 -0400 (EDT) |
Precedence: |
list |
Resent-From: |
|
Resent-Sender: |
|
X-Status: |
|
From [log in to unmask] Tue Aug 6 17: |
53:53 1996 |
X-Mailing-List: |
|
X-Sender: |
|
TO: |
|
Return-Path: |
<TechNet-request> |
Status: |
O |
Resent-Message-ID: |
<"kNygO1.0.3-K.K7u1o"@ipc> |
Subject: |
|
From: |
|
X-Loop: |
|
Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0unq0D-0000P8C; Tue, 6 Aug 96 12:33 CDT |
X-Mailer: |
Windows Eudora Light Version 1.5.2 |
Message-Id: |
|
Parts/Attachments: |
|
|
One of our students is looking for information on the Entech coating process
for copper lines. Can anyone tell me where to find that? I have heard of it
as a process ... is it a company as well?
Ron Gedney
[log in to unmask]
Integrated Electronic Eng. Center
Watson School of Eng. & Applied Science
Binghamton University
P.O. Box 6000
Binghamton, NY 13902
607-777-4335, fax 4683
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|