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| From [log in to unmask] Tue Aug 6 17: |
52:26 1996 |
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To those interested electroless nickel immersion gold:
As we all have seen or read the higher the phosphorous content of the
electroless nickel the poorer the solderability. Also keeping the phosphorus
content in the low range has some difficulties.
In an article in the August 1996 "Plating and Surface Finishing" page 62, a
paper from China shows that codeposition of tungsten with electroless nickel
produces good solderable electroless nickel and keeps the phosphorous content
in the 2 wt% range. The tungsten content is about 4.3 wt% in the deposit
and will increase the electrical resistivity of the deposit.
The same issue has an article on electrodeposition Pd-Ni alloy deposits that
has corrosion resistance, high hardness etc. The article does not so state
but I have heard that the solderability of 80Pd-20Ni was very good.
Phil Hinton
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