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id m0ulzGq-0000M2C; Thu, 1 Aug 96 10:02 CDT |
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| From [log in to unmask] Thu Aug 1 11: |
02:13 1996 |
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My subcontract assembler is experiencing whisker formation after
(convection) reflow soldering on 208 QFP packages. Eutectic solder
paste is used. I haven't performed XRF on the package nor the PCB, but
I suspect high Sn content. Any comments would be greatly appreciated.
Greg Kilinski
Acuson Corp.
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