TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0ula1h-0000MdC; Wed, 31 Jul 96 07:05 CDT
Old-Return-Path:
Date:
Wed, 31 Jul 1996 08:06:12 -0500
Precedence:
list
Resent-From:
Resent-Sender:
TechNet-request [log in to unmask]
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/5459
TO:
Return-Path:
<TechNet-request>
Resent-Message-ID:
<"KBgC73.0.vcL.0mq_n"@ipc>
Subject:
From:
From [log in to unmask] Wed Jul 31 17:
24:49 1996
X-Loop:
Message-Id:
Parts/Attachments:
text/plain (23 lines)

        I am a university student who is looking to ascertain the strength 
      of SMT solder joints.  I would like to know if there are any standard 
      industry practices which are used to measure the force required to 
      pull an SMT solder joint apart.  I am mostly interested in solder 
      joints involving J-type and gull-wing leads. Any information would be 
      appreciated.
          
      Thank You,
          
      Valquirio N. Carvalho
          
      [log in to unmask]  

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2