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id m0ukxbN-0000LMC; Mon, 29 Jul 96 14:03 CDT |
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| From [log in to unmask] Tue Jul 30 12: |
04:53 1996 |
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Hello TechNetters!
Has anyone had any experience with blind vias in BGA pads? The
BGA is a 225 I/O, 1.27mm" pitch. The ball diameter is .0295" and
the pad size being considered is .030". The via hole size is
.012" maximum. I have had success with vias in pads that go
through the board but I'm concerned about using a blind via in the
BGA attachment pad due to outgassing or some other unknown
problem.
Thanks in advance.
Harlan
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