 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uksf9-0000RCC; Mon, 29 Jul 96 08:47 CDT |
| Encoding: |
15 TEXT |
| Old-Return-Path: |
|
| Date: |
Mon, 29 Jul 96 08:54:00 CDT |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| From [log in to unmask] Tue Jul 30 12: |
00:27 1996 |
| Resent-Message-ID: |
<"-TnMF.0.akN.U3C_n"@ipc> |
| Subject: |
|
| From: |
|
| X-Loop: |
|
| X-Mailer: |
Microsoft Mail V3.0 |
| Message-ID: |
|
| Parts/Attachments: |
|
|
Hello,
I am wondering if someone out there could tell me where I could find any
information on Radial Component Lead Spacings and Lead Forms. Is there a
governing agency that sets these standards? For example someone must specify
what a TO-92 Transistor package is, and what the lead spacings/forming
options are. Please send your response.
Thanks for your time!
Mike Brinker
Mfg. Eng.
Electronic Assembly Corp
414-751-3637
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
