TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Content-Type:
text/plain; charset="us-ascii"
Old-Return-Path:
Date:
Thu, 25 Jul 1996 17:18:17 -0400
Precedence:
list
Resent-From:
Resent-Sender:
TechNet-request [log in to unmask]
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/5349
X-Sender:
TO:
Return-Path:
<TechNet-request>
X-Loop:
Resent-Message-ID:
<"9gYQ.0.6RA.fT-zn"@ipc>
Subject:
From:
Len Brown <[log in to unmask]>
Received:
by ipc.org (Smail3.1.28.1 #2) id m0ujXz8-0000RrC; Thu, 25 Jul 96 16:30 CDT
From [log in to unmask] Thu Jul 25 16:
55:28 1996
X-Mailer:
Windows Eudora Pro Version 2.1.2
Message-Id:
Parts/Attachments:
text/plain (22 lines)
        We are experiencing a type of contamination on completed board
assemblies (we don't have access to bare boards). Under microscopic
inspection, some surface mount parts have a brown "gun powder" like
substance appearing on part of the solder joint. Scrubbing with a solvent is
required to remove it.
        1)  Has anyone experienced this?
        2)  What could it be - and what could be the root cause?
        2)  Is it something we should worry about?
        3)  Is there a cure?

Possibly related- all boards with this defect also have a number of traces
which appear to be over etched.

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2