cycles.
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I would be most interested in any publications or experiences about
component degradation resulting from  thru-hole components being
exposed to reflow temperatures after placing SMT parts. The natural
flow of an assembly line would be to place SMT components and then
insert thru-hole components. However, as a subcontractor,  layout
designs don't always conform to manufacturability standards and due to
interference from bottom side SMT parts conflicting with insertion
machine anvils,  being able to insert thru-hole parts, especially dips, and
then place bottom side SMT devices would be considerable.

I would also be interested in reviewing other methods about building
such layout designs without increasing hand placement labor.

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