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I have read through many articles, papers, etc. about the pros and
cons
of using Nitrogen in the reflow process. It appears that oxygen levels
of 1000 ppm or less is recommended with Nitrogen use. The benefits
being less solder balls, better alignment, and better wetting. The
price of the Nitrogen consumption is the concern.
Does anyone have supporting information not to use Nitrogen as a cost
saving/reduction without significantly affecting reliability?
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