Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0ugYwv-00009uC; Wed, 17 Jul 96 10:55 CDT |
Old-Return-Path: |
|
Date: |
Wed, 17 Jul 1996 11:57:54 -0500 |
Precedence: |
list |
Resent-From: |
|
Resent-Sender: |
|
From [log in to unmask] Fri Jul 19 16: |
31:22 1996 |
Status: |
O |
X-Mailing-List: |
|
TO: |
|
Return-Path: |
<TechNet-request> |
Resent-Message-ID: |
<"67ui82.0.bU7.ypGxn"@ipc> |
Subject: |
|
From: |
|
X-Status: |
|
X-Loop: |
|
Message-Id: |
|
Parts/Attachments: |
|
|
Has anyone performed a SWOT (Strengths, Weaknesses, Opportunities &
Threats) analysis on what it takes to make the transistion from an
in-house internal PCB Assembly process (mixed technology) vs.
utilizing contract PCB assembly vendors ? and would you be willing to
share this analysis.
Basically a good strawman of what are the key transistion factors
(business & technical considerations) is what we are after.
Thanks,
D.Drake
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|