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| From [log in to unmask] Tue Jul 16 14: |
13:21 1996 |
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There is an article on"factors influencing solderability of electroless Ni-P
deposits" By Jing Li Fang, Xiang Rong Ye and Jing Fang in Plating and
surface finishing Vol 79 , No 7 , 1992 P44-47. In this article they talk
about the effect of the %P on the solderability and also other factors such
as the PH, bath temperature, complexing agent etc...
Start with this one.
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