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| From [log in to unmask] Tue Jul 16 08: |
54:36 1996 |
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I am in the process of having samples made with Cu/Ni/Pd/Au for gold
wire bonding. The gold in this process is immersion gold. This is
touted by two suppliers as a reliable surface for bonding. I also
have yet another supplier telling me that their electroless
nickel/electroless palladium process (NO gold) is also bondable. This
will be tested too.
I have had samples made in the past with just e-nickel and immersion
gold (which we are all experts on now) which were ball bonded with
gold wire.
I have been told that the gold wires adhered to the immersion gold
when they were new, but they won't be good for the long term. How can
I stress the deposits to determine how good my surface finishes are?
That is: How would I know if it is reliable enough for me to offer it
to MY customers?
Matt Byrne
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