TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0ug0kc-00009uC; Mon, 15 Jul 96 22:24 CDT
Old-Return-Path:
Date:
Tue, 16 Jul 96 11:41:47
Precedence:
list
Resent-From:
Resent-Sender:
TechNet-request [log in to unmask]
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/5209
TO:
Return-Path:
<TechNet-request>
Resent-Message-ID:
<"YXqLz2.0.aT6.vjmwn"@ipc>
Subject:
From:
From [log in to unmask] Tue Jul 16 08:
54:22 1996
X-Loop:
Message-Id:
Parts/Attachments:
text/plain (33 lines)

     Dear TechNet,
     
     Is anyone aware of any standards or other specifications for the 
     packaging of finished, populated PCBs, for overseas shipment by air, 
     land or sea ?
     
     We are looking at standardizing our internal procedures for this and 
     would like to align with world standards, if they exist.
     
     
     TIA
     
     Eugenio Bini
     Materials Engineer
     
     ERG Telecommunications
     247 Balcatta Rd.
     Balcatta
     WA 6021
     Australia
     Tel.(+619) 2731174
     Fax.(+619) 2731173

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************



ATOM RSS1 RSS2