Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0ufYcM-0000EeC; Sun, 14 Jul 96 16:22 CDT |
Old-Return-Path: |
|
Date: |
p 13 Jul 96 14:33:17 PST |
Precedence: |
list |
Resent-From: |
|
Resent-Sender: |
|
X-Status: |
|
Status: |
O |
X-Mailing-List: |
|
TO: |
|
Return-Path: |
<TechNet-request> |
Resent-Message-ID: |
<"bjb0K.0.L-5.9KMwn"@ipc> |
Subject: |
|
From: |
|
From [log in to unmask] Tue Jul 16 08: |
45:52 1996 |
X-Loop: |
|
Message-Id: |
|
Parts/Attachments: |
|
|
Contact WR Grace!
______________________________ Reply Separator _________________________________
Subject: GEN: Carbon Ink vs. Gold Reliability
Author: [log in to unmask] at corp
Date: 7/11/96 8:30 PM
Can someone point me toward information that provides data on the
reliability difference between carbon ink and selective gold plating for PWB
surface switch contacts?
Norm Dill
[log in to unmask]
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|