 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0ueqQI-0000EZC; Fri, 12 Jul 96 17:10 CDT |
| Content-Type: |
text/plain; charset="us-ascii" |
| Old-Return-Path: |
|
| Date: |
Fri, 12 Jul 1996 15:18:53 -0700 |
| Precedence: |
list |
| Resent-From: |
|
| Message-ID: |
|
| MIME-Version: |
1.0 |
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| X-Status: |
|
| X-Loop: |
|
| Resent-Message-ID: |
<"OB8j41.0.ZpD.irivn"@ipc> |
| Subject: |
|
| From: |
|
| From [log in to unmask] Tue Jul 16 08: |
43:46 1996 |
| Content-Transfer-Encoding: |
7bit |
| X-Mailer: |
Microsoft Exchange Server Internet Mail Connector Version 4.0.838.14 |
| Resent-Sender: |
|
| Parts/Attachments: |
|
|
Does anyone know of any materials that are scratch-resistant like
Teflon, but meet U.L. flammability requirements? I am looking for
alternatives to the polyimide coverlayer that I need to put on a
flexible printed circuit. Any input would be greatly appreciated.
Nelson P. Calimquim
Project Engineering Supervisor
M-Flex
E-mail: [log in to unmask]
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
