Sorry about the garbage address included in the last attempt
to send this. (So much for trusting reply mode)
The V/mil rating of the various adhesives between the traces
ranged from 3100 to 3800 volts/mil.
These flex circuits included trace encapsulation with
polyimide coverfilm. Examination of x-sections showed that
the dendritic growth was following the field lines between
traces in the coverfilm adhesive. For the materials that
were failing, the adhesive itself was acting like a solid
state electrolyte. The incubation period was related to the
time it took for the ionic level of the adhesive to attack
the traces and get copper in solution, creating something
like a plating cell.
By the way, all of the Rogers R/flex adhesives have been
tested and are immune to this effect.
Andy Magee
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______________________________ Reply Separator
_________________________________
Subject: FW: Re[2]: Humidity Testing
Author: Dill, Norm J::(DILLNJ) at ~FABRIK
Date: 7/11/96 5:46 AM
From: Dill, Norm J
Date: Thu, Jul 11, 1996 5:46 AM
Subject: FW: Re[2]: Humidity Testing
To: "'IPC - Technet Input'"
Andy,
Considering your test was run at 100 v with a .006" spacing, is
there
any chance that airborne contaminants contributed to your 300/500
hour
failures?
Norm Dill
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------------------------
Subject: Re[2]: Humidity Testing
Date: Wednesday, July 10, 1996 4:18PM
We've done some testing on flex circuits and found that
there was about a 300 hour incubation period before visible
defects were evident on the failing circuits. Actual
electrical failures (shorting) took up to 500 hours. The
insulation resistance falls off early in the test as the
moisture reaches equilibrium in the polyimide, and then
falls further at about the time of the incubation period.
The continuous bias voltage was 100V. 85C, 85%RH 100 mA
current limited, 0.006" spaces between traces. Measurements
were taken at 24, 48, 72, 144, 200, 300, 400, 500, 550 and
1500 hours.
Andy Magee - Applications Engineer
Rogers Corp - Circuit Materials Unit
Tel: (602) 917-5237
Fax: (602) 917-5256
E-Mail: [log in to unmask]
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Subject: Re: Humidity Testing
Author: SIRGuru::(SIRGUR) at ~FABRIK
Date: 7/10/96 1:12 PM
From: [log in to unmask]
Date: Wed, Jul 10, 1996 1:12 PM
Subject: Re: Humidity Testing
To: TechNet
I'll give you my favorite engineering answer - It depends.
If you are trying to determine if a fabrication or assembly process
is
Bellcore-compliant, the answer is no. Bellcore compliancy is only
obtained
through the SIR and Electromigration testing in Chapter 13 of TR-78.
If you are trying to determine if a vendor has acceptable product,
and you
don't really care about Bellcore compliance, then I would say the
answer is
yes. The seven day SIR test, IPC-TM-650, method 2.6.3.3 rev A, is an
alternative.
The Bellcore electromigration test is 85C/85% RH, so is the SIR
method.
The Bellcore test goes 96 hours before the first measurement in an
unbiased
state, then a bias of 10 volts is applied.
The SIR test is biased from the start with a 50 volt bias.
The Bellcore test is not tied to an absolute resistance value.
The SIR test has a minimum of 100 megohms.
I'm not really trying to bash the Bellcore electromigration test, but
I
understand the time constraint. In my opinion (that and 50 cents
gets you a
Diet Coke), you are best to do both methods concurrently. The SIR
test should
be able to allow you to make the decision in 7 days vs. 25 days.
Alternatively, you could interrupt the electromigration test after
7-10 days
and see if you have any signs of corrosion or metal migration. It
has been
my experience that if you have not seen electromigration and
corrosion after
7 days at 85/85 and a 50 volt bias, you would not see it in 500
hours.
Again, my opinion.
Hope this was helpful. If you want to discuss it in greater depth,
give me a
call at (317) 457-8095.
Doug Pauls
CSL, Inc.
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