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10 Jul 96 22:42:08 EDT |
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| From [log in to unmask] Thu Jul 11 13: |
19:39 1996 |
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Does anyone have information or data on what chemical control limits are
required (specific gravity, pH, temperature, etc.) to maintain a constant etcher
conveyer speed for a given copper plating thickness such as 1 oz base and 1 mil
electroplated Cu? We have done a lot of testing and tried a lot of control
schemes. Nothing seems to work reliably. We still etch one piece, measure the
line width, adjust the conveyor speed accordingly and then run the lot.
Hans Rohr.
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