 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0udzid-0000F5C; Wed, 10 Jul 96 08:54 CDT |
| Old-Return-Path: |
|
| Date: |
Wed, 10 Jul 1996 10:03:44 -0400 |
| Precedence: |
list |
| Resent-From: |
|
| Message-ID: |
|
| X-Status: |
|
| Status: |
O |
| From [log in to unmask] Wed Jul 10 09: |
29:13 1996 |
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"i4O9I.0.ScL.BOxun"@ipc> |
| Subject: |
|
| From: |
|
| X-Loop: |
|
| X-Mailing-List: |
|
| Resent-Sender: |
|
| Parts/Attachments: |
|
|
There are two primary equations that I know of. The first is more of a rule
of thumb and is based on an Arrhenius rate of reaction. The second, which is
recommended, is the Eyring Model. The IPC SIR Handbook (IPC-9201), which is
nearing publication, has a section detailing this equation. It can also be
found in the original report of the Low Residue Soldering Task Force. I
don't think it will come across well as an ASCII text message. If you will
give me a fax number or mailing address, I can send you the necessary
references.
Doug Pauls
CSL
[log in to unmask]
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
