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| From [log in to unmask] Tue Jul 9 12: |
07:33 1996 |
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J-STD-001B states that when humidity decreases to 30% or lower,
the manufacturer shall verify that ESD control is adequate and that
sufficient moisture is present for flux performance and solder paste
applications.
For operator comfort, J-STD-001 recommends temp to be between 18-30C,
and relative humidity not exceed 70%.
J-STD-001B, Requirements for Soldered Electrical and Electronic Assemblies,
is currently at 2nd interim final circulation. We anticipate an August
publication.
Mike Buetow
IPC Technical Staff
2215 Sanders Road
Northbrook, IL 60062
P: 847-509-9700, ext. 335
F: 847-509-9798
[log in to unmask]
On Wed, 3 Jul 1996, Kevin M. McCoy wrote:
> Our PWB assembly facility is in a controlled environment kept at 72
> degrees F, and 50% R.H. The problem is, we don't remember how we
> decided these were the best conditions. Does anyone know of an IPC
> document or other source stating the best environmental conditions for
> PWB assembly (including SM assembly)?
> Any info. is appreciated. Thank you.
>
>
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