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| From [log in to unmask] Mon Jul 8 11: |
19:54 1996 |
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GENERAL COMMENT:
THERE IS A BALLOT CIRCULATING FOR A PROPOSED JOINT JEDEC/IPS STANDARD
"MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR PLASTIC INTEGRATED
CIRCUIT SURFACE-MOUNT DEVICES". IF APPROVED, TO BE PUBLISHED AS
J-STD-020. BALLOT JC-14.1-96-93, PN-3793. CONTACT JEDEC.
______________________________ Reply Separator _________________________________
Subject: re: Moisture Sensitivity
Author: [log in to unmask] at smtp
Date: 7/7/96 09:39 PM
DIPAK SENGUPTA
PACKAGE AND ASSEMBLY PROCESS DEVELOPMENT
ANALOG DEVICES
TEL: 617-937-1629
FAX: 617-937-1700
E-MAIL: [log in to unmask]
-------------
Original Text
>From [log in to unmask], on 6/27/96 12:34 PM:
To: <[log in to unmask]>
Hey folks,Ok, we all know that certain surface mount components are
moisturesensitive. This means that they may suffer damage during
reflowsoldering conditions due to moisture expansion.We are currently
attempting to develop a company policy regarding theselittle beasties, but are
having some difficulty. The problem is compounded by the fact that no one
packaging standardis followed universally. We have component bags come in
witheverything from simple moisture warning labels to labels with
specificinstructions about humidity and temperature exposure -- anything but
theIPC's recommended 1-6 classification. So my question is this: how are other
companies handling thesecomponents? Also if you're using Vidmar type cabinets,
please specify what gasyou're using to keep them dry (I'm trying to determine
if dry compressedair is adequate).Thanks!Dirk BellamyManufacturing
EngineerCurrent Electronics
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