 
| Mime-Version: |
1.0 |
| Content-Type: |
text/plain; charset="us-ascii" |
| Old-Return-Path: |
|
| Date: |
Wed, 03 Jul 1996 13:45:43 -0400 |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| X-Sender: |
|
| TO: |
|
| From [log in to unmask] Wed Jul 3 12: |
49:52 1996 |
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"H88mH.0.p53.flgsn"@ipc> |
| Subject: |
|
| From: |
|
| X-Loop: |
|
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0ubVbW-0000CrC; Wed, 3 Jul 96 12:20 CDT |
| X-Mailer: |
Windows Eudora Light Version 1.5.2 |
| Message-Id: |
|
| Parts/Attachments: |
|
|
We are looking for a test to determine the hardness of developed dry film
resist. A problem that keeps cropping up is dry film break down after df
strip/etch and we would like to rule out soft or hard dry film after develop.
|
|
|
