Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0ubU30-0000DLC; Wed, 3 Jul 96 10:40 CDT |
Old-Return-Path: |
|
Date: |
Wed, 3 Jul 1996 11:49:31 -0400 |
Precedence: |
list |
Resent-From: |
|
Resent-Sender: |
|
X-Status: |
|
Status: |
O |
X-Mailing-List: |
|
TO: |
|
From [log in to unmask] Wed Jul 3 12: |
19:05 1996 |
Return-Path: |
<TechNet-request> |
Resent-Message-ID: |
<"NIcE72.0.qjI.8Ifsn"@ipc> |
Subject: |
|
From: |
|
X-Loop: |
|
Message-ID: |
|
Parts/Attachments: |
|
|
dear ed,
as i responded to ed - Atotech has an electroless process called PD-Tech -
which is an electroless palladium process. this process is presently being
worked into automotive spec, along with a few others.
electroless palladium will not allow copper to difuse - bonding
characteristics comprable or better than gold - no barrier plate of nickel
required - can be gold plated over top if required - such as tabs - and
finish of board is flat - board manufacturer cost shud not run much more than
HASL and less expensive than electroless gold.
shud u require more info please e-mail back to:
miscantor@aol com
regards
rick fudalewski
Atotech
|
|
|