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Tue, 2 Jul 1996 20:00:35 -0400 |
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| From [log in to unmask] Wed Jul 3 09: |
37:32 1996 |
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<"Hcwg_.0.sbE.TPRsn"@ipc> |
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Martin, from the information in your note, it seems you have a mixed
technology board ie PIH and SMT. The components that are affected are called
NON-WET and should be attached/soldered after the main assembly process.
Non-Wets are hand soldered with a no-clean flux.
If you still require the component(s) to be protected during cleaning
process, please provide detailed process flow information with temperatures
and chemicals involved. Any masking tape used has to meet the process
temperature and chemicals.
Pratap Singh
RAMP Labs
512-255-6820
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