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From [log in to unmask] Wed Jul 3 09: |
09:49 1996 |
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Hi Vic
One problem you will encounter is "boiling" the flux out of the solder
paste and launching solderballs everywhere. A controlled preheat ramp
prevents this from happening.
Dave Hillman
Rockwell Collins
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______________________________ Reply Separator _________________________________
Subject: Changing of reflow profile.
Author: [log in to unmask] at ccmgw1
Date: 7/1/96 10:20 AM
Hi,
I am a student doing research at the temperature issue during the IR
reflow process. As I know that there is a well-defined temperature
profile for the PCB when passing through the oven. I just wonder if it
is possible to forget all the preheat, ramp up periods and go straight
into the spike zone where solder paste will melt at that temperature?
What are the potential problems I have to face in this context, excluding
the thermal mass issue?
Any input is appreciated. Thanks in advance.
Vic.
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