TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Content-Type:
text/plain; charset="us-ascii"
Old-Return-Path:
Date:
Mon, 1 Jul 1996 10:22:26 -0500 (CDT)
Precedence:
list
Resent-From:
Resent-Sender:
TechNet-request [log in to unmask]
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/4937
X-Sender:
TO:
Return-Path:
<TechNet-request>
X-Loop:
Resent-Message-ID:
<"iPF6S.0.ugF.Wi-rn"@ipc>
Subject:
From:
David Arivett <[log in to unmask]>
Received:
by ipc.org (Smail3.1.28.1 #2) id m0uakfR-0000CmC; Mon, 1 Jul 96 10:13 CDT
From [log in to unmask] Wed Jul 3 09:
08:59 1996
X-Mailer:
Windows Eudora Light Version 1.5.2
Message-Id:
Parts/Attachments:
text/plain (13 lines)
Hello, 

We are currently using the Black Hole process in our double-sided shop and
have problems getting the surface clean enough to go directly into outer
layer imaging without scrubbing first. If we do not scrub we don't have
resist adhesion problems, but end up with electrical shorts due to
insufficient etching in spots. By scrubbing, we risk creating interfacial
voids on large PTH's (and have seen some). My question is for people using
Black Hole, Shadow or other similar technology. Do you have to scrub and
have you had similar experience? By the way, we use pumice scrub.



ATOM RSS1 RSS2