TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0uYvGV-0000FGC; Wed, 26 Jun 96 09:08 CDT
From [log in to unmask] Wed Jun 26 13:
38:01 1996
Old-Return-Path:
Date:
Wed, 26 Jun 96 07:12:10 PDT
Precedence:
list
Resent-From:
Cc:
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/4859
TO:
Return-Path:
<TechNet-request>
Resent-Message-ID:
<"cx3t02.0.Yb8.HHKqn"@ipc>
Subject:
From:
[log in to unmask] ( Kevin Seaman )
X-Loop:
Resent-Sender:
TechNet-request [log in to unmask]
Message-Id:
Parts/Attachments:
text/plain (23 lines)
HOWZITGOIN?

Gary Willard wrote:

...are there any major concerns or advantages in having the vias
connecting directly into the plane without relief...

At Rockwell, flooded (no thermal relief) vias have been standard
operating procedure for the last 5 years.  We just photo plot a
round circle that is smaller than the hole size (ie: .004") for
each plane connection.  It's small enough to get drilled away
but large enough so the fab house doesn't think we forgot about
those holes.

Thank you and have a FANTASTIC day!

Kevin L. Seaman (714) 221-4752

P.S. If your "reply" bounces back, then "send" to:
[log in to unmask]



ATOM RSS1 RSS2