 
| X400-Content-Type: |
P2-1988 ( 22 ) |
| Old-Return-Path: |
|
| Date: |
20 Jun 1996 17:36:37 -0500 |
| X-Status: |
|
| Precedence: |
list |
| Resent-From: |
|
| Conversion: |
Allowed |
| Disclose-Recipients: |
Prohibited |
| Resent-Sender: |
|
| MIME-Version: |
1.0 |
| Status: |
O |
| Priority: |
normal |
| X-Loop: |
|
| X-Mailing-List: |
|
| Content-Return: |
Allowed |
| X400-MTS-Identifier: |
[/c=US/admd=MCI/prmd=Honeywell/; 0580831C9D2756A6-HW-MTA-AZ] |
| TO: |
|
| Message-Id: |
<0580831C9D2756A6*/c=US/admd=MCI/prmd=Honeywell/o=AZ-MTA/ou=MSMail/ou=CAS/s=Edwards/g=Ted/i=A/@MHS> |
| Original-Encoded-Information-Types: |
IA5-Text |
| X400-Originator: |
|
| X400-Recipients: |
non-disclosure; |
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uWt45-0000EFC; Thu, 20 Jun 96 18:23 CDT |
| From [log in to unmask] Fri Jun 21 09: |
00:33 1996 |
| Resent-Message-ID: |
<"44Dx03.0.iO2.OrTon"@ipc> |
| Subject: |
|
| From: |
|
| Alternate-Recipient: |
Allowed |
| X400-Received: |
by /c=US/admd=MCI/prmd=Honeywell/; converted ( IA5-Text);
Relayed; 20 Jun 1996 17:36:37 -0500
by mta HW-MTA-AZ in /c=US/admd=MCI/prmd=Honeywell/; converted (
IA5-Text); Relayed; 20 Jun 1996 17:36:37 -0500 |
| Return-Path: |
<TechNet-request> |
| Content-Identifier: |
0580831C9D2756A6 |
| Parts/Attachments: |
|
|
Test data shows the Aramid material is one of the type materials that picks
up moisture that needs to be removed before assembly operations where the
board sees temperatures where water is converted to steam. Steam occupies
much more volume than water and this causes blistering, delamination and
other not nice effects on the PWB
----------
From: [log in to unmask]
To: [log in to unmask]
Subject: ASSY: Aramid material and baking
Date: Thursday, June 20, 1996 2:22PM
Please forgive my ignorance, but what are the undesirable effects
from not baking Aramid material prior to assembly?
[log in to unmask]
|
|
|
